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Multi Project Wafer Schedule 2008

The timescales indicated below include the preparation of data from the different submissions,
fabrication with the maximum amount of process options, and individual dicing. To find out the
timescales of standard engineering lots please contact your local sales and support office.

X-CMOS 0.18 µm (*)

Process	Tape In	Samples Out
XC018	20-Mar-08	15-Jul-08
XC018	20-Jun-08	16-Oct-08
XC018	20-Aug-08	16-Dec-08
XC018	17-Oct-08	12-Feb-09
XC018	19-Dec-08	16-Apr-09
0.18 um FC	16-Jan-08	28-Apr-08
0.18 um FC	11-Jun-08	22-Sep-08

X-CMOS 0.25 µm (*)

Process	Tape In	Samples Out
0.25 um FC	09-Jan-08	07-Apr-08
0.25 um FC	07-May-08	04-Aug-08
0.25 um FC	09-Jul-08	06-Oct-08
0.25 um FC	05-Nov-08	02-Feb-09

X-CMOS 0.35 µm (*)

Process	Tape In	Samples Out
XH035	11-Jan-08	16-May-08
XH035	11-Apr-08	15-Aug-08
XH035	11-Jul-08	14-Nov-08
XH035	10-Oct-08	13-Feb-09

X-CMOS 0.6 µm (*)

Process	Tape In	Samples Out
XC06	08-Feb-08	05-Jun-08
XC06	02-May-08	28-Aug-08
XC06	22-Aug-08	18-Dec-08
XC06	21-Nov-08	19-Mar-09

X-BiCMOS 0.6 µm (*)

Process	Tape In	Samples Out
XB06	22-Feb-08	05-Jun-08
XB06	06-Jun-08	18-Sep-08
XB06	12-Sep-08	29-Dec-08
XB06	07-Nov-08	19-Feb-09

X-SOI Trench Isolated CMOS 0.6 µm (*)

Process	Tape In	Samples Out
XT06	15-Feb-08	04-Jul-08
XT06	20-Jun-08	07-Nov-08
XT06	24-Oct-08	13-Mar-09

X-CMOS 0.8 µm (*)

Process	Tape In	Samples Out
CX08HW	18-Jan-08	10-Apr-08
CX08HW	23-May-08	14-Aug-08
CX08HW	26-Sep-08	18-Dec-08

X-SOI CMOS 1 µm (*)

Process	Tape In	Samples Out
XI10	29-Feb-08	27-May-08
XI10	22-Aug-08	18-Nov-08

X-DIMOS 1.0 µm (**)

Process	Tape In	Samples Out
XDH10/XDM10	14-Mar-08	10-Jul-08
XDH10/XDM10	04-Jul-08	30-Oct-08
XDH10/XDM10	10-Oct-08	05-Feb-09

SOI-based Surface-Micro-Machining-Technology for inertial sensors (**)

Process	Tape In
XM30	on request